Electronics Engineering Coaching Materials: Section 5 Module 1

(Last Updated On: March 30, 2018)

Electronics Coaching Materials: Section 5 Module 1

This is the Section 5 Module 1 of the compiled Electronics Coaching Materials taken from different sources including but not limited to Electronics books, past Board Exams Questions, Journals and other Electronics References. This particular Coaching Notes in Electronics Engineering has random Questions and Answers in random topics. Make sure to familiarize each questions to increase the chance of passing the ECE Board Exam.

Electronics Engineering Coaching: Section 5 Module 1

1. Total energy of revolving electrons – can never be positive

2. Major part of the current in an intrinsic semiconductor – conduction band electrons

3. voltage applied across PN junction – bias

4. intrinsic semicon doped with very small amount of boron – number of electrons and holes will decrease and increase respectively

5. hall effect – causes the resultant electric field which is normal to both current and magnetic field

6. reverse current in an intrinsic semiconductor doubles for every 6 C increase in temp

7. without dc source, clipper acts as rectifier

8. clamper – introduces dc to ac signal

9. gallium compounds are used to fabricate LED because it emits more light

10. LED – normally forward biased PN junction

11. Laser signal characteristics – coherent, collimated, monochromatic

12. ideal amp – response only to the signals at the input terminal

13. in a CE amp, if voltage gain is increased, ac load resistance is also increased.

14. if bypass capacitor in CE amp is removed, voltage gain is reduced

15. negative output swing of transistor clips when Q is near saturation

16. positive output swing of transistor clips when Q is going towards cutoff

17. improper biasing – causes distortion to the output signal

18. bias stability – improved by keeping the base current constant

19. early effect – base narrowing; effective variations in the base width by collector voltage; also called base-width modulation

20. voltage divider bias – independent of transistor beta

21. capacity of lead acid is NOT dependent on rate of charge

22. lead acid cell – lead peroxide, dilute sulfuric acid, sponge lead

23. Anderson bridge – measuring inductance with known capacitance and resistance

24. De Sauty bridge – comparing capacitances of two air capacitor

25. Maxwell’s Wien bridge – measures inductance

26. heaviside Campbell equal ratio bridge – measure self inductance with mutual inductance

27. moving coil can measure – both ac and dc current and voltage

28. digital comp does not use floating point hardware – because its costly

29. ho parameter – smallest among the h-parameters

30. h-parameters depend on – operating point, configuration, temperature

31. number of card read per minute of a card reader – 10,000

32. access to magnetic drum memory – partly random and part cyclic sequential

33. emmiter coupled monoshot – perfect gate wave generator

34. miller circuit – uses integrator to convert step waveform to ramp waveform

35. phantastron – uses pulses to convert step waveform to ramp waveform

36. bootstrap circuit –

37. thermal runaway – increase in temp, causes an increase in the collector current burning the transistor

38. magnetic deflection system used by CRT to deflect electron beam

39. cyclotron / magnetic resonator – Lawrence and Livingston

40. unbiased PN junction – 0.5um

41. nonservo controlled robot – high repeatability; high operating speed; low cost

42. servo controlled repeatability – 2mm

43. microcomputer communicates with the system with – 3 buses

44. walk through – programming a continuous path robot

45. robot is – mechanical engineering, electronics, computer science, control theories

46. karel capek – robot

47. ted hoff – microprocessor, 1969

48. volatile ROM – semiconductor ROM

49. semiconductor ROM – combinational logic circuit

50. % conductivity
a. Annealed silver wire – 108.8
b. 99.9% gold – 72.6
c. 99.5% aluminum – 63

51. 100Hz – 150kHz – converter transformer

52. 20kHz – 20MHz – carrier frequency transformer

53. power transformer – not operated in 100Hz

54. stray loss – not a transformer loss

55. copper loss – most losses in transformer

56. common drain – buffer amplifier

57. common gate – high frequency amplifier

58. common source – voltage amplifier

59. glass – strongest dielectric

60. ampacity of wire – maximum current the wire can safely carry

61. selsyn

62. 1dB – minimum audio power output that can be heard

63. 0dB – noise figure of an ideal opamp

64. emission coefficient / destability factor – account to the effect of recombination in the depletion region

65. ringing circuit – RLC with undamped oscillations

66. megger – used to measure high resistance

67. cut-in voltage / turn on voltage – amount of voltage where the current increases exponentially

68. impedance relay – used in medium transmission

69. skin effect – occurs at high frequency

70. surge absorber – used in low voltage, high frequency

71. Ferranti effect – when the load in the receiving end is removed, the sending end voltage is less than the receiving end voltage

72. shunt capacitance / shunt admittance – negligible in short transmission

73. increase in transmission tower height, causes a change in capacitance

74. corona – causes radio interference

75. 105 – total number of elements including those in the laboratory

76. 1.6V – forward voltage of LED

77. transformer – two coils of wire wound in an iron core

78. saturation voltage of op amp is 2V smaller than power supply voltage

79. ceramic capacitor – used as a bypass capacitor in high frequency amplifier

80. control grid – single grid in vacuum triode

81. triode – most common type of tube used as an amplifier

82. solenoid – electromagnetic device used to convert electrical to mechanical energy

83. film IC – consists of passive elements

84. wheatstone bridge – used to measure medium resistance – 1ohm to few megaohm

85. wien bridge – used to measure capacitance in great accuracy

Diode Formula and Boost converter Buck converter Buck-Boost converter
Electronics Engineering Coaching Materials: Section 5 Module 1

86. Schering bridge – used to measure capacitance

87. 3 – 8 inches – diameter of silicon before processing

88. multivibrator – not a common type of sine wave oscillators

89. Class A – low efficiency; 50% max efficiency; worst case: no input

90. Class B – push pull; darlington pair

91. 1,000,000 – ideal gain of an op amp

92. CMRR – infinity for different inputs

93. Feedback component
a. resistor – differentiation
b. capacitor – integrator

94. oscillation – barkhausen principle; power factor – 1; phase shift – 0o

95. monostable – 1µs to 1ms; 1ms to 10ms

96. free running oscillator no external pulse

97. floating battery – for telephone exchange; emergency lightning purposes

98. antimony lead alloy – sediment of lead acid

99. thin film – ceramic substrate

100. monolithic IC – digital circuits

101. jhonson noise – produce due to different energy produced

102. TTL – least propagation delay

103. ECL – least propagation time

104. CMOS –least dissipation power

105. Ic = Icbo + αIe

106. GaAs LED – needs infrared

107. EPROM – uses UV signal to remove memory

108. Comparator – no feedback

109. Fermi gap – forbidden gap

110. crystal – most stable

111. NAND latch – S-0 C-0

112. NOR latch S-1 C-1

113. bolometer

114. stroboscope

115. ondograph

116. VFET – square law device; parabolic transconductance; depletion mode

117. enhancement N MOSFET – high +V

118. gate current – extremely small

119. monolithic – high extensive components

120. candela – intensity of light

121. lux – illuminance

122. stable sine wave audio generator – astable multivibrator

123. half adder – adds 2 binary digits produced sum and carry

124. full adder – adds 2 binary digit and produces carry from the previous

125. binary system – mostly used in computers

126. temperature coefficient of semicon – negative

127. temperature coefficient of carbon – negative

128. hexadecimal – uses numbers and letters

129. water – is not created nor absorbed in Ni Fe

130. mean life time – creation and disappearance of electrons

131. opamp – same sign input – 0 output; infinite Zin, 0 current

132. universal motor – for as and dc, dependent on supply frequency

133. torque – controlled by commutation

134. series motor – high torque

135. inverting summer – has parallel inputs

136. bode plot – amplitude variation vs logarithm of input signal frequency

137. MOSFET – high input impedance

138. swinburne’s test – most economical test for motors

139. 95% – current through the collector

140. grounding wire – 4 below 660 V

141. resistance grounding – 3.3 kV to 11 V

142. earthing – to prevent electric shock

143. curie law – paramagnetic proportional to 1/T

144. gross error / personal error – made by human

145. random error – unknown error

146. systematic error – from equipments

147. F.T. bacon – 1st fuel battery

148. common mode rejection of opamp – 100 to 10000 or 4odB to 80dB

149. ammeter-connected on series

150. 50ohm – ideal Rin of op amp

151. opamp – high Zin, 0 current; low Zo, has negative feedback

152. microcontroller – stand alone system of microprocessor

153. thermopile – array / groups of thermocouple

154. wet cell – Zinc and Cooper

155. emergency cell – silver zinc

156. data in array – RAM

157. combinational logic circuits – CPU

158. Ni-Cd cells can be replaced

159. lead acid – 2.1 V

160. NMOS – 6X slower than PMOS

Complete List of Electronics Engineering Coaching Materials

Electronics Engineering Coaching Materials: Section 5 Module 1
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